TSMC, Samsung, and Intel collectively shift towards advanced packaging, reshaping the process roll p......

2026-06-13

11

On June 9th, industry news showed that TSMC, Samsung, and Intel, the three global wafer giants, have synchronized their strategic shifts and are no longer solely focused on 3nm/2nm extreme advanced processes. They are collectively investing heavily in advanced packaging, glass su......

NVIDIA Rubin GPU adopts advanced packaging, and the commercialization of glass substrates was offici......

2026-06-13

6

On June 6th, NVIDIA announced that the new generation of Rubin GPU is equipped with advanced packaging technology, with a single package value 6-10 times that of traditional packaging. Intel showcases EMIB+glass substrate integrated samples simultaneously, achieving a breakthroug......

Computex, Nvidia supports Maiwell, AI chip industry chain restructuring begins

2026-06-13

6

At the Taipei Computex 2026 conference, Huang Renxun publicly stated that Maiwell is expected to grow into a trillion dollar enterprise, and Maiwell's stock price surged by 37% in a single day. Nvidia has officially formed a computing ecosystem alliance with Maiwell, directly cha......

Changxin Technology's IPO on the Science and Technology Innovation Board has passed, with plans to r......

2026-06-13

6

On May 27th, the Shanghai Stock Exchange approved Changxin Technology's IPO application on the Science and Technology Innovation Board, with a planned fundraising of 29.5 billion yuan, making it the second largest financing project in the history of the Science and Technology Inn......

The first 8-inch silicon optical chip mass production line in Suzhou has started, ushering in a year......

2026-06-13

5

Suzhou has officially started construction of the first standardized production line for 8-inch silicon optical chips in China, marking the transition from laboratory research and development to large-scale production of silicon optical chips. TSMC's COUPE optical interconnect te......

Global smartphone SoC shipments in Q1 fell 8% year-on-year, putting pressure on terminal chip demand

2026-06-13

6

The global shipment of main SoC chips for mobile phones in the first quarter of 2026 decreased by 8% year-on-year, and the recovery of the global smartphone market fell short of expectations. The price increase of storage chips has raised the BOM cost of the whole machine, and te......